3D stacked integration technologies: Overview and future prospects

Abstract

The evolution of 3D integration technologies is reviewed. The market for the electronics and information industries has grown to more than 3000 billion USD due to both the improved performance and marketability of semiconductor devices and systems. Scaling and packaging technologies drive those industries. However, scaling is facing physical limits, and the performance of packaging technologies has saturated. Three-dimensional integration technology is expected to offer new breakthroughs for tackling these two issues. In this paper, to achieve the even higher integration and functionality that meets the market demands, the history of 3D multilevel technology developed worldwide for front-end and back-end processes is described, and our recent work on wafer level 3D integration is also introduced.