2020 Volume 89 Issue 6 Pages 314-320
For the move toward the next generation of computing, which will enable IoT and AI technologies, high-speed, high-capacity and low-power memory will be needed more than ever before. Recently, ferroelectricity has been discovered in a very common material, HfO2, which is already used in the CMOS process. Ferroelectric-HfO2 is attracting a lot of attention for memory device applications. What is so different from conventional ferroelectric materials? What opportunities will ferroelectric-HfO2 give us? In this report, I will describe the impact of ferroelectric-HfO2 on device society and then I will explain the current status and challenges of ferroelectric-HfO2 memory devices.