Abstract
Alkoxide-derived silica gel films were deposited on silicon substrates, and heated at a constant rate in a near infrared image furnace, where in situ observation was made using an optical microscope. Gel film deposition and heat-treatment were conducted in controlled humidity. It was found that the cracking of the films occurred in the heating-up stage, and that the cracking onset temperature shifted to lower temperatures as the humidity increased. The film thickness was found to slightly decrease with increasing humidity while the porosity of the films was almost unchanged.
