Abstract
AlN is a candidate material as SiC-based metal-insulator-semiconductor (MIS) structures for high-power devices and high-temperature applications. In this study, wurtzite AlN films on the Si and C faces of SiC were characterized by SEM, AFM, TEM and XPS. From XPS results, the photoelectron cross-sectional ratios of Al2p to N1s on the Si face was larger than that on the C face. The results indicate that polarity of AlN on the Si face is different from that on the C face.