Abstract
Recently, interesting issues in mixed signal communication such wireless transceivers are the miniaturization of devices and the reduction of cost. Integration of passive devices such as inductors and capacitors is an important step toward miniaturization and reduction of cost. In order to integrate passive devices, SOP technologies such as low temperature co-fired ceramic (LTCC), multilayer organic (MLO), and multi-chip module deposition (MCM-D) have been developed. In the particular, embedding high quality inductors into packaging substrate have become a major task due to forming a critical part of bias networks, filters, and low-noise devices. This paper discusses the design of LTCC-based high Q inductors by the layout optimization of inductor footprint. The modeling of inductors has been performed by a circuit simulator to analyze the multi-coupled lines, which are the main parts of the LTCC-based inductor. Also, the effect of the structural parameters on the properties of inductor has been investigated.
