Wettability of Ni-Base and Cu-Base Filler Metals Against Si3N4

Hideki TAKASE; Masaaki NAKA; Julius C. SCHUSTER

doi:10.14853/pcersj.2003F.0.302.0

16th Fall Meeting of The Ceramic Society of Japan & The 5th International Meeting of Pacific Rim Ceramic Societies(PacRim5)

セッションID: 05-P-13

DOI https://doi.org/10.14853/pcersj.2003F.0.302.0

会議情報

主催: The Ceramic Society of Japan

Wettability of Ni-Base and Cu-Base Filler Metals Against Si₃N₄

*Hideki TAKASE, Masaaki NAKA, Julius C. SCHUSTER

著者情報

会議録・要旨集フリー

詳細

抄録

Heat resistant Ni-Sn and Ni-Si base filler Metals were developed. Wettability of Ni-Sn-Ti and Ni-Si-Ti filler metals against Si3N4 were evaluated by measuring contact angle in vacuum, and also observing the microstructure of the interface between alloys and the ceramics. The contact angle of the Ni-20Si-10Ti alloy shows the lowest among Ni-20Si alloys. The addition of Ti definitely reduces the contact angle of Cu base alloy on Si 3N 4.

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