Abstract
Aerosol Deposition enables to deposit the ceramic film around room temperature with a nozzle, by making use of the solidification with bombardment of nano-size ceramic particles which are accelerated near sound velocity. We have researched the embedded passive organic substrate with multi-layered high-dielectric constant ceramic condenser. We have conducted the deposition technology of the aerosol deposition of BaTiO3 and clarified that the condenser with the dielectric constant of 400 (max) and the capacitance density of 300nF/cm2 could be formed on the printed wiring board.
In this study, we report the relationship between the micro-structure of AD film and the dielectric properties in various reliability test such as the thermal cycle test, pressure cooker test and so on.