Abstract
We have developed thin film capacitor embedded printed wiring board with high capacitance density (>40 nF/cm2). The thin film was fabricated by coating barium titanate (BaTiO3) nanoparticles mono-dispersed in suspension. We have investigated preparing thin films with higher packing density of nanoparticles because dielectric properties of thin film were affected by packing density of nanoparticles. We report the effect of particle size, particle distribution, and repulsive forces acted among nanoparticles on packing density of particles in the film at this meeting.