Abstract
To realize high performance and miniaturization of LTCC modules, thin-film ceramic capacitor(TFCC)formed directly on LTCC substrate with multi-terminal structures bonding directly with BGA package or WL-CSP was proposed. The TFCC was prepared using low cost aero-sol CVD(AS-CVD)method for SrTiO3(STO)dielectric thin film formation and Ag sputtering thin films as electrodes. The Ag/STO/Ag TFCC with STO thickness of about 0.5um, formed directly on as-fired LTCC substrate showed stable electric properties of capacitance density of 40 nF/cm2, dielectric loss <1% (1kHz-1MHz) and leakage current of 0.1uA/cm2 at 30VDC.
