Application of sputter deposited dielectric thin films to capacitors

Abstract

Improvement of passive component like multilayer ceramic capacitor (MLCC) has supported advancement in performance of mobile electronic equipment such as mobile phones. Nowadays these MLCC are composed of below 1μm thick active layers. But to fabricate thinner than 1μm dielectric layer is very difficult for conventional ceramic process. Therefore there is much expectation for the process technologies for further thinning such as sputtering method. In this presentation, we introduce the characteristics of sputter deposited thin films.