Proceedings of JSPE Semestrial Meeting
2002 JSPE Autumn Meeting
Session ID : J25
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Host: The Japan Society for Precision Engineering

Evaluation of the new type diamond pad conditioner for CMP process
*Toshiyuki Ooi, Tomoyoshi Hara, Masayuki Sagawa, Yoshiki Nishioka
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Keywords: chemical mechanical polishing, removal rate, polishing pad
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[in Japanese]
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© 2002 The Japan Society for Precision Engineering
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