Proceedings of JSPE Semestrial Meeting
2003 JSPE Autumn Meeting
Session ID : I19
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Host: The Japan Society of Precision Engineering

Development of vacuum bonding apparatus for room-temperature precise bonding of 4-inch wafers
*Hideki Takagi, Ryutaro Maeda
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Keywords: wafer bonding, room-temperature bonding, surface activation, precise bonding, MEMS packaging
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[in Japanese]
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© 2003 The Japan Society for Precision Engineering
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