Proceedings of JSPE Semestrial Meeting
2003 JSPE Autumn Meeting
Session ID : I20
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Host: The Japan Society of Precision Engineering

Hermetic sealing using surface activated bonding method
*Hironao Okada, Toshihiro Itoh, Tadatomo Suga
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Keywords: pressure sensor, resonant sensor, sealing, MEMS packaging, Surface Activated Bonding
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[in Japanese]
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© 2003 The Japan Society for Precision Engineering
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