Proceedings of JSPE Semestrial Meeting
2005 JSPE Autumn Meeting
Session ID : P76
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High aspect ratio micro hole drilling ofFused Silica with Electroplated Diamond Tools
*Kunio AshinoTsunehisa SuzukiTakashi Konno
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Abstract
Fused silica, due to its excellent corrosion resistance and optical characteristics, is used in semiconductor equipment and chemical analysis parts. In this study, an electroplated diamond tool was developed using Quality Engineering specifically for the purpose of drilling of high aspect ratio micro holes (diameter 0.1mm, depth 2mm, aspect ratio 20) in fused silica. This engineered tool was able to drill 35 high aspect ratio micro holes, mentioned above, unlike commercial tools. In addition further drilling was possible with the tool.
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© 2005 The Japan Society for Precision Engineering
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