We have been developing a novel 3D micro–fabrication method (FORMULA technology) and a manufacturing equipment for 3D micro–devices such as micro optical devices and high accuracy MEMS etc.
In this method, a 3D microstructure is fabricated by stacking thin film patterns using surface–activated bonding at room temperature. Therefore, accuracy of 3D microstructure is influence by accuracy of positioning stage greatly.
We developed a fine positioning stage with high accuracy (positioning accuracy of 50nm) and maximum axial load (1ton). Additionally, This stage succeeded in controlled also in vacuum systems with base pressures of 10
–6Pa. In consequence, 3D microstructure with 150nm accuracy was achieved by applying this stage and FORMULA technology in manufacturing equipment.
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