ELID 研削とMRF 磁性流体研磨を併用した超精密複合加工プロセスの開発 第4 報:シリコンウエハのMRF特性

尹 韶輝; 林 偉民; 大森 整; 上原 嘉宏; 浅見 宗明; 劉 慶; 鈴木 亨; 渡邉 裕; 森田 晋也

doi:10.11522/pscjspe.2005A.0.261.0

2005 JSPE Autumn Meeting

Session ID : D08

DOI https://doi.org/10.11522/pscjspe.2005A.0.261.0

Conference information

Host: The Japan Society for Precision Engineering

Development of Ultra-precision ELID/MRF Complex Fabrication Process

*Shaohui Yin, Weimin Lin, Hitoshi Ohmori, Yoshihiro Uehara, Muneaki Asami, Qing Liu, Toru Suzuki, Yutaka Watanabe, Shinya Morita

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Keywords: ELID grinding, MRF, silicon wafer, surface roughness, form accuracy

CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract

Magneto –rheological Finishing (MRF) was applied to nano–precision finishing of silicon wafer. Several sets of finishing experiments for silicon wafer have been performed to verify obtainable surface roughness and removal rate. Influence of some process parameters such as wheel rotation, magnetizing current, immersed depth and MR fluids viscosity on removal rate were investigated. The surface micro–roughness less than 10 Angstrom for silicon mirror were produced.

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