Planarization of Thin Film Surface by CMP for surface-activated bonding

Abstract

We have been developing a novel microfabrication technology using surface–activated bonding (SAB) of thin film patterns. Firstly, we report that the surface roughness of the film is very important for SAB and is successfully improved by CMP. Then the guideline of CMP condition is studied to achieve simultaneous polish of heterogeneous materials in an advanced FORMULA process which employs sacrificial material as well as structural material.