Abstract
MIPOX is the only company providing total solutions of leading edge technology for surface control. We were developing a fixed abrasive pad with composed high purity cerium oxide for next generation CMP technology. For less than 90nm device to achieve subsumable yields, CMP process need high accuracy planarization and low cost pad.
Especially fixed abrasive pad is effective for next generation CMP process.
We can achieve the development of fixed abrasive pad called by advanced CMP process Pad (ACP pad) for oxide process. And also we developed new technology using DI water without any chemicals.
In this presentation, we provide you the basic characteristic such as removal rate, uniformity and planarity using our fixed abrasive pad compared with conventional pad.
