Development of the Ultra-Precision Lathe for Lens Dies without Polishing

Abstract

Our laboratory have been developed the Ultra–Precision Lathe for Lens Dies without Polishing. We tried ductile–mode cutting to Si wafer and optical glass (BK7) using this lathe, and observed processed area by Confocal Scanning Laser Microscope with a Raman Spectroscopy Interface. By obtained Raman spectra, amorphous layer were found from ductile–mode cutting area of silicon, and different spectra were observed from the ductile–mode cutting area and brittle–mode cutting area of glass.