Abstract
Material removal mechanism of grinding is explained by the theory of successive cutting edge spacing. An Engineered Tool has been developed to perform high–quality ductile mode grinding of brittle materials. The tool has multi–cutting edges that are uniform size, form, and spaces. This paper discusses an experiment to explore adequate successive cutting edge spacing. Single point diamond tool was attached on precision turning machine to cut single crystal Si wafer with vibration excitation. As a result, the phase shifts of machined traces were ascertained corresponding to the calculation of cutting edge′s motion.
