Proceedings of JSPE Semestrial Meeting
2005 JSPE Autumn Meeting
Session ID : G64
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Experimental Analysis of Characteristics of Resin Filling in Microscopic Grooves by Ultra-High Speed Injection Compression Molding
Hidetoshi Yokoi*Akira Ohmori
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Abstract
Ultra–high–speed injection molding gradually proved to be quite useful for high transcription rate molding of microscopic grooves. In this study, we attempted to combine this technology with the well–known injection compression molding, which is widely utilized in the molding of CDs and DVDs, for realizing a higher transcription rate as an ultimate transcription molding technology. In this paper, the results obtained using a stamper with line and space patterns of 3 to 5μm in line width (depth and pitch; 5μm) and PMMA were reported and discussed in detail.
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© 2005 The Japan Society for Precision Engineering
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