A Novel Silicone Micro Connector Cast with the Rapid-Prototyped Mold for Packaging of Bare Chips

Abstract

In this study, we proposed a novel silicone rubber connector for bare chip packaging. The proposed connector has metal–coated silicone pillars held in an elastomer substrate. The both edges of the silicone pillars projecting from the both faces of the substrate work as contact points to pads of a bare chip and a printed–circuit board (PCB). These elastic contact points can absorb the warpage of a PCB and a bare chip and allow multiple chip replacement impossible with the conventional flip–chip bonding. The connector was made by casting liquid silicone rubber into micro pillar arrays with a rapid–prototyped mold. We tested the electric continuity of each contact point and confirmed the feasibility of the proposed connector.