Abstract
Fundamental cutting characteristics of solid type board, which was composed of copper lead frame and epoxy resin molding compounds, by SHG:YAG laser were experimentally investigated. Almost equal cutting speed could be obtained by this laser cutting technique compared to current dicing method using grinding blade. However, the spatter adhered to terminal increased with increasing laser power and feed rate. This spatter could be decreased by cutting from the resin side, and the damage of terminal could be reduced. On the other hand, resin material was excessively removed compared to copper lead frame, since the thermophysical properties of composite material was different in leaser irradiation direction. However, this difference of removal between copper and resin could be improved by controlling the feed rate.
