The multi-wire saw is one of the effective slicing methods to make base wafer of IC or LSI, and uses the slurry in processing. The slurry is the working fluid mixed abrasive grains. In this slicing method, the slurry is supplied on the tensioned thin piano wire and is carried to processing area with the motion of wire running. Therefore, the adhesion conditions and behavior of slurry affect the slicing characteristics. This paper observed the slurry behavior in the slicing grooves and at the processing area by means of high speed camera, and the relationship between slurry behavior and slicing characteristics was studied and the processing mechanism of multi-wire saw was considered.

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The diamond wire tool is a slicing tool electrodeposited diamond grains. Authors expect that this wire tool is one of the next coming slicing methods. But, as this wire tool has some problems of tool cost, tool life and so on, this wire tool has been only used in the narrow range of electronic material processing. This study describes the slicing results using the multi-wire saw on sale and the wire tool by nickel coated diamond grains. And, the slicing results obtained by diamond wire tool were compared with the slicing results of normal multi-wire saw by slurry mixed GC grains.

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The diamond wire tool is one of the tools for slicing processing of brittle materials. As this wire tool is ten times as high slicing efficiency as the slurry type of wire saw, this tool is expected for the next coming generation processing. This study has manufactured this wire tool in the flow plating fluid and has discussed the possibility of high speed manufacturing. This report examined the relationship between the exit shape of plating pipe and plating conditions of abrasive grains. And, the behavior of abrasive grains in the plating pipe was observed by a high speed camera. As the results, it is clear that the grains on the wire surface is plating by moving of the sedimentary grains in the plating pipe.

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In recent years, in the multi cutting of ingot of the silicon, glass, sapphire and so on, the loose abrasive wire saw becomes mainstream. However, there are problems of the cutting efficiency, the slurry management, the industrial waste and so on. To solve these problems, fixed abrasive diamond wire saw is mainly expected. The authors developed the diamond wire saw which fixed diamond abrasive with resin bond. This report describes about the influence which the wire speed and the diamond abrasive interval exert on the cutting efficiency and the cutting precision.

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A measuring system which measures the running accuracy of saw wire with a laser diode and a dual-element photodiode was developed. As a basic experiment, we elucidate the arrangement of the saw wire of 160 um in diameter and the a dual-element photodiode and the laser beam focus which gives the best measurement accuracy.

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The object in this study is to establish “Mild Cooling Air Machining Method” that removes cutting heat by two ways: One of them is removed by about –5°C mild cooling air. The other is removed by tool side which is applied removing cutting heat contrivance. In 1st report, one of ways: removing heat from tool was noticed. In 2nd report, the other way: removing heat from air jet was noticed. In this paper, combination of two ways is examined and attempted greater heat removing. In this time, two types of air jet are used: One is mild cooling air generated by Vortex Tube (VT air), the other is normal temperature air (Normal air). Experiment is carried by using only VT air, Normal air and by combining them with holder cool, and the same parameters in previous reports are considered. As collect, by combining two ways, the tip temperature fall, and flank wear and ten-point average roughness on work became short. And tip temperature is also fallen by using Normal air. So the usefulness of combining two ways is confirmed. And the usefulness by using Normal air is also confirmed. But when the tip temperature fall, the efficiency become short.

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In this study, cutting characteristics of optical films were investigated by using various types of cutting edge. The cut surface was observed through an optical microscope and its roughness and existence of extruded adhesives were evaluated. Among the various cutting edges, the cutting edge coated with thin film of DLC was superior both in quality of cut surface and tool life.

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This paper deals with the effect of disk material on sawing performance and vibration characteristic when sawing carbon steel S45C. Three kinds of tool steel SK5, SKS5 and NBSP1 are compared. NBSP1 is high silicon content, and is superior on quenching. The tool failure and surface roughness of workpiece are observed at a sawing speed of 130m/min and a feed of 0.07mm/tooth. The chipping resistant of NBSP1 is better than the other tool steels. The sawing performance is influenced by the hardness variation of disk when brazing tip.

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When the thermosetting phenol or epoxy resin often used for onventional resin bond grinding wheel are used as a bonding agent for making bonded abrasive pellets used for MCP of Si wafers, subsurface damage caused by scratching action of the thermally deteriorated resin might be sometimes left on the Si wafer surface. Binder-free pellets made of mica abrasive only were developed by forming under high pressure over 150MPa at room temperature. Practical polishing efficiency and excellent surface features were obtained.

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A slot-structured type diamond cutter is widely used as a cutting tool for cutting materials vertically in a straight line. The slot clearances promote the self-sharpening of each slot and also function as chip-pockets. These functions have the effect of reducing cutting resistance and increasing the tool life. Against this background, the application of photopolymerizable resins to the slot-structured type blade has been examined. In this paper, two types of slot-structured blade (slot-structured and slot-filled with resin structure) were proposed and experiments were performed to investigate cutting characteristics during dicing. As the result of a series of cutting tests on silicon wafers, with the slot-filled-structure resin blade, the improvement of machinability was verified.

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In this study, polishing characteristics of pyramidal structured polishing pad which contained alumina abrasive have been investigated. In order to understand the effect of cutting edge wear on the polishing characteristics, a series of polishing tests for S45C have been carried out. As a result, the topography of cutting edge wear in the polishing has been grasped and it has been shown that dressing conditions affect the formation of cutting edge on contact area.

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In a fabrication of the Ni-W electroplated micro diamond tool, an influence that a method of stirring the electroplated liquid exerted on the distribution of the abrasive grain was investigated. Furthermore, the tool life at the single crystalline silicon machining with the electroplated tools was examined.

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Repeatable On-the-Machine Tool Forming Technology can provide wide variety of tooling strategy. In this study, we tried to establish repeating process for resin bonded grinding tools using rapid baking system. Forming and removing abrasive layer of grinding tools are done with same rapid baking system. The result of experiments shows us the possibility of the technology.

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FFT analysis to polished surfaces, prepared by Four-Body Finishing, was conducted and the amplitude spectrums thus obtained were used in study of the geometric characteristics of the surfaces to reveal how the polymer particles and tool plate working surfaces affect them. The results showed that addition of polymer particles into the polishing slurries affects primarily the low frequency components, i.e. the waviness, and could improve the high frequency components, i.e. the roughness. Also noticed was that the roughness and materials of tool plates affect the polished surfaces significantly. It is possible to optimize the geometric characteristics of polished surfaces by appropriately combining polymer particles, at optimal weight percent, with tool plates of proper working surfaces and materials.

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There are many factors which affect processing in lapping processing. The research on the conventional lapping processing has measured and evaluated surface coarseness and processing rate. However, the conventional method was evaluated for single quality items, such as the characteristic of polish liquid, and a performance of lapping powder. Therefore, the whole processing to two or more quality items has not necessarily been optimized efficiently. In this research, optimization of lapping processing conditions was tried using the quality engineering which can improve the quality of many items efficiently. The experiment showed that the factor which has big influence on lapping processing was state change of a surfactant.

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In order to improve the surface accuracies in grinding process, it is important to evaluate the geometrical shapes of grinding wheel surfaces as a tool used grinding process. In this study, a new three-dimensional measuring method for the surface geometries of grinding wheels by using a laser displacement sensor is proposed. As experimental results, it is confirmed that three-dimensional shapes of grinding wheel surfaces can be evaluated quantitatively in the proposed method.

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A newly contact detecting device which detects the collision between a dresser and a grinding wheel is developed in this study. This device uses the piezoelectric-element to detect the contact. It is obviously application of piezoelectric-elements is widely spread, and the cost of piezoelectric-elements is low priced. Therefore, it is considered that the use of piezoelectric-elements makes it facilitates to reduce the price of the detecting device. This report presents the way of development of the device using a piezoelectric-element, and experimental results of the comparison to acoustic emission sensor.

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To make three dimension minute parts, the purpose of this research is to inspect, and to develop the micro fabrication system adapting the passed-around one of die mold technology. This system laminates the form of the Cavity by filling the Photopolymerizing polymer to the Cavity arranged in row, and irradiates ultraviolet rays one by one, and makes three dimension minute parts. It succeeded in molding three dimension minute parts at hundreds of micro meter level because of use and molding this system.

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In this research, it proposed new stereolithography and the micro piller was made in a short time. This method processes it by the laser in using a metallic board of the thickness of μm. And, the surface where ultraviolet rays other than a necessary part are interrupted is made. Piller of high aspect was made by irradiating ultraviolet rays to the mask. As a result, the shape of three dimensions was made without using laminating from the mask of two dimensions.

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In recent years, the stereolithography that is one of the Rapid Prototyping technologies has attracted more attention. In this study, we propose a novel stereolithography method, in which the evanescent wave with higher resolution is used as the exposure energy and aim at establishing the nano-stereolithography with higher accuracy and flexibility. We demonstrated the feasibility of lithography with the resolution of 100 nm scale by using evanescent wave in previous reports. In this report, we make theoretical and experimental analyses about the resolution of this three-dimensional fabrication method and verify the validity of stereolithography using evanescent wave.

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In this research, we propose the LCD microstereolithography using liquid-crystal-display as an exposure mask and this method is one of the micromachining techniques which enable microfabrication of micro 3D structure rapidly, easily and automatically. In this paper, we examined the mechanism of the surplus growth which is a problem in the fabrication of the overhanging shape as the complex structures and investigated the applicable condition of LCD grayscale gradient to reduce the surplus growth.

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Ceramic nanoparticles reinforced photosensitive resins are developed by the mixing silica (SiO2) particles with mean diameter of 130nm uniformly into photosensitive resins, and basic photosensitive characteristics and mechanical strengths of developed resin were evaluated in this research. In order to examine mechanical strength on specimens due to particles mixing, their reinforcing properties are evaluated from experimental results hardness and tensile test on fabricated resin by using micro Vickers hardness tester and microforce testing system.

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The purpose of this research work is to produce micro part reinforced by unidirectional short fiber by laser photolithography. Short fibers are added to liquid photopolymer. By applying magnetic field to this mixture, the axes of the short fibers are aligned along the direction of the magnetic field. Then, the photopolymer is solidified by the irradiation of UV laser in the desired shape. This paper deals with development of manufacturing apparatus to produce the micro part. The apparatus is composed of four electromagnets in horizontal directions and one in perpendicular direction. The magnitude and direction of the magnetic field generated by these electromagnets can be changed.

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Stereolithography is used in a trial production field.Now the applicable field of Stereolithography has spread, it is based on improvement in the molding accuracy of Stereolithography. We research which make a multi-freedom stepping motor by Stereolithography, the purpose of research is finding the conditions which can drive a multi-freedom stepping motor. We calculated using the magnetic field analysis method, and report the results of those calculations.

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Integrating an electrical element into a prototyped part would add an entirely new dimension to the usefulness of Solid Freeform Fabrication Technology and could lead to new materials, construction methods and geometries into the world or electrical circuit design. The advancement in the high precision fluid control technologies nowadays makes it possible to deposit 0.1mm diameter of viscous fluid avoiding fluctuations in dispensing volume and fluid buildup. This study explore the possibility of directly dispense layers of high aspect ratio conductive patterns in-between stereolithography resin layers to fabricate parts with electrical functionality embedded in them.

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Injection mold having deep or high aspect ratio rib produce high-value added products. High aspect ratio features problems can be solved by Metal Laser Sintering Combined with High Speed Milling because the process is suitable for producing deep rib shape. However, mold of this shape have difficulty of venting air in the mold during the injection molding process. This is due to residue air in the mold is compressed and generates heat thus giving negative effect on the product. By using breathable materials, influence of residue air on the product can be reduced. This study describes the fundamental experiments done on producing breathable materials by Metal Laser Sintering Combined with High Speed Milling.

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Selective Laser Sintering (SLS) is one of the layered fabrication methods that use metal powder. SLS is use as mold production method because it can produce difficult and complicated molds form easily compared by machining method. However, SLS is not applicable in producing molds that requires high precision because it causes warping and shape transformation. The warping and shape transformation is caused by the temperature distribution generated by the laser irradiation. This study looks into how the temperature distribution is affected by the laser irradiation.

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Shortening of the development period of a product and reduction of cost are becoming very important. Rapid Prototyping which is applicable for die and metal parts was used to realize this. This research is on the use of CAE to design and analyze Selective Laser Sintering (SLS) metal molds. However, because physical-properties of the metal powder used in SLS was unknown, it is difficult to analyze the injection molding process using these molds. This paper focused on Young′s Modulus which is one of the physical properties value for CAE analysis. Fundamental experiment on how the Young′s Modulus value changes due to different parameter setting on the SLS machine was done.

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Producing metallic molds using Metal Laser Sintering combined with High Speed Milling can significantly reduce mold fabrication time. Nevertheless, a level difference in the cutting profile makes it difficult to fabricate high precision mold due to warpage. Although high density and low density lasering differentiation reduce the fabrication time, the introduction of ribs to replace this low density lasering will not only reduce the fabrication time but also improve the mold strength. This study explores on internal structures design possibilities that can improve mold strength and reduce fabrication time.

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Among commercially available rapid prototyping processes, SLS is the most effective in terms of adaptability of various materials. However, SLS processed parts are always opaque because of their porosity. In this paper, we will fabricate transparentized parts from SLS parts by post processing that is infiltrating themoplastic resin whose refractive index is close to SLS resin into SLS parts, and curing the infiltration resin. We will evaluate those parts, and discuss factors that lower transparency of transparentized parts.

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The study deals with development of a forging type rapid prototyping system. The forging type rapid prototyping means not only numerical automation of free forging and metal hammering workings on the basis of CAD data but also creating 3-D models by use of plastic deformation of the material. However the processing method has fatal problems in dimensional accuracy of the processed workpiece. In order to improve the dimensional accuracy, a feedback CAM system which collects path considering the 3-D dimensional error measured by a range finder comparing with defined shape is developed. From the experimental result, the system is found effective to have enough ability to improve the accuracy of the process.

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As the physical dimensions of semiconductor device shrinks, 2-Dimensional carrier profiling techniques are expected to become indispensable for the process technology development, device design, and failure analysis in nano-scale. Nowadays, there are several candidates in the scanning probe microscopy (SPM) related techniques for that purpose. As a new approach to improve spatial resolution and sensitivity, we have developed self-sensing probe, and applied to the scanning capacitance microscopy. This self-sensing probe consists of bulk metal tip, and quartz oscillator as a force sensor. The bulk metal tip of this probe enables higher sensitivity and stability than conventional metal-coated ones, and self-sensing capability keeps from undesirable photocarrier effect. With the use of this probe, 2-dimensional p-n junction locus was observed with a spatial resolution better than 5 nm in the dC/dV imaging.

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In this study, the measuring system for nano-particles which can measure the particle on Si wafer surface by the sensitivity of a nanometer order using a light-scattering method is developed. Although there is a report which detected the standard nano-particle of 37nm of particle diameter until now, but there is still no report which detected the standard nano-particle less than 30nm of particle diameter. Then, the detection accuracy of the measuring system for nano-particles was evaluated using standard nano-particle of 28nm of particle diameter.

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In this study , development of electron beam EB exposed SOG by heating was investigated. Namely, dependence of developed depth of SOG on heating temperature and time were mainly i nvestigated. From this experiment, it is concluded th at maximum developed depth of EB exposed SOG with heating at 500°C for 1hour is 30nm. Usually we use BHF to development of SOG, but we are able to develop without BHF by thermal Desorption. We think that is effective to environmental measures.

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Chemical reaction at surface is one of typical heterogeneous reactions and is often affected by steps, vacancies, impurities, and the distribution of adsorbates. It is crucial to unveil the catalytic activity of surface local structure. The advent of scanning tunneling microscopy (STM) has opened our eyes to real events going on a surface. The atom-resolved imaging of surface structure variation over the course of chemical reactions allows us to identify active sites where reactions occur preferentially and investigate how the reactions progress. These promote our understanding of the correlation between the surface local structure, electronic structure and chemical reactivity and then stimulate the development of new catalysts. Using variable temperature STM, we have studied time evolution of chemical reactions on added-row reconstructed Ag(110)(n×1)-O surfaces where one-dimensional -Ag-O-Ag-O- chains arrange periodically. Two topics will be presented: (1) clean-off reaction of O adatoms by CO on Ag(110)(2×1)-O and (2) the reaction of H2O with O adatoms on Ag(110)(6×1)-O. The time evolution of surface structures provides microscopic models for these reactions.

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Recently, Si(110) surface is a basic importance in surfaces science and semiconductor technology, because the hole mobility of Si(110) with a radical oxidation method has already been achieved to be 2.4 times higher than that of Si(001). We observed atomically resolved STM image on hydrogen-terminated Si(110) surfaces after wet cleaning and concluded that some characteristic features such as a zigzag chain inside a terrace, a single-row bright spot at a step edge and an isolated zigzag chain on a terrace are found when the sample is rinsed with ultrapure water. Consequently we carry out first-principles calculations based on density-functional theory to investigate the electronic structures of various hydrogen-terminated Si(110) surfaces. The present calculations show that the calculated STM images of the filled states are consistent with the results obtained by experiments using STM.

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The purpose of this study is to develop High-Frequency Pulse-Modulated STM(Scanning Tunneling Microscopy) which has an ability to observe atomic and electronic structures of insulator surfaces. In usual alternating STM measurements, there is a problem about the stray capacitance induced by an alternating bias voltage. We have solved the problem by applying a rectangular-shaped bias voltage with a high frequency between a tip and a sample, and developing a novel external detector circuit. In this paper, we introduce High-Frequency Pulse-Modulated STM with a highly rigid scanner. And the performance of our system is shown.

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A micro capacitive inclination sensor was developed by using micro machining techniques. Electrodes of the sensor are 40 um in a gap and 12 mm² in area. The sensor detects difference of capacitance, which varies with movement of silicone oil accompanying with inclination of the sensor, but there is a problem of surface tension caused by the narrow gap of the electrodes. In order to solve the problem, novel structures of the sensor for injection of the oil into micro channels and retaining a horizontal plane of the oil were devised. As a result, downsizing of the sensor was realized.

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New contact method without applying large force is required for testing of LSI devices of next generation. Fritting phenomena, which is a kind of electric breakdown, has been focused as a method for low-force contact probing. One of the advantages of fritting contact is less damage on the probe or on the electrode on the LSI devices. In our previous work, however, the electrode materials were found to adhere to the probe after hundreds of contacts. In this report, the characteristics of the contact duration and observation of adhesion to the probe will be reported using probes of different materials in order to discuss the influences of probe material on the contact duration.

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Probing at the time of LSI test is becoming difficult by the miniaturization of electrodes as LSI devices become more high-density. In conventional probing, electric contact has been achieved by breaking of aluminum oxide on the electrodes by mechanical force. This large force about 100 mN gave the damage to the device and the probe, and has caused the problem of restricting miniaturization of a probe card. In this research, a new method of contact using removable bumps on device electrodes will be proposed. In this report, a fundamental characteristic measurement of contact using the existing conductive resin material will be presented.

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LIGA process has been developed in the 2.5-dimensional world. We are introducing technologies of 3D X-ray lithography, worm injection molding with unscrewing demolding mechanism, and succeeded in the deployment to three dimensions of LIGA process. Furthermore, it succeeded in the trial production of a spiral microcoil using 3D-LIGA process and metalization technique combined flat and smooth electroplating with a leveling agent and isotropic chemistry etching. A diameter of this microcoil was 0.5 mm and the length was 1 mm. The width of coil line was 10 um, and pitches was 20 um. Also performing performance estimation as an inductor, inductance was 91nH at frequency of 1 GHz.

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Glass-like carbon (GC) is expected as a die material for mold-press of optical glass lens. However, mechanical and thermal properties of the GC are not enough to use as precision mold die. So, GC reinforced by carbon nanotube (CNT) or GC/CNT composite was developed to improve the mechanical and thermal properties. Vapor grown carbon nanotube (VG-CNT) effectively improved the thermal properties of GC due to its very high aspect ratio and smooth morphology. On the other hand, Cup-stacked carbon nanotube (CS-CNT) effectively improved the mechanical properties due to its unique surface morphology. However, FIB etching surface roughnesses of GC/CNT composites are increased up to 33nm with increasing CNT content. To improve this problem, we developed functionally graded GC/VG-CNT composites with GC surface.

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Micro/Nano imprinting or hot embossing is a target of interest for industrial production of micro devices especially for the applications for fluidic MEMS(Micro Electro Mechanical Systems) and optical MEMS. In our previous study, Glassy Carbon mold fabricated by Focused Ion Beam was employed for the process. However the main problem is that the machined area by FIB is limited within several hundreds um2, whereas in the optical and fluidic MEMS applications, wide area of several 10 mm2 of processing is needed. This is the reason why we investigated the femto-second laser machining to GC mold fabrication. Micro hot embossing of Pyrex glass was demonstrated by using the mold and the process conditions are optimized.

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Micro/Nano imprinting or hot embossing is a target of interest for industrial production of micro and nano devices. In Fluidic MEMS (Micro Electro Mechanical Systems) applications, polymer materials have been employed for their low cost fabricate the economical products. However glasses are much more suitable for the higher temperature applications or under the strong chemical environments. In Optical MEMS as well, glasses are good candidate materials for the better optical properties. In our previous study, Micro/Nano imprinting was developed for Pyrex glasses using GC (Glassy Carbon) mold prepared by FIB(Focused Ion Beam) machining. The disadvantage of FIB machining is limited area of etching. The typical area of FIB is less than several hundreds micro meter square. This is the reason why we tried the large area of embossing using GC mold fabricated by dicing machine. Micro hot embossed test structures were successfully demonstrated with good fidelity by using the mold.

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Micro/Nano imprinting or hot embossing is a target of interest for industrial production of micro devices especially for the applications for fluidic MEMS(Micro Electro Mechanical Systems) and optical MEMS. In our previous study, Glassy Carbon(GC) mold fabricated by Focused Ion Beam(FIB) was employed for the process. However the main problem is that the machined area by FIB is limited within several hundreds um2, whereas in the optical and fluidic MEMS applications, wide area of several 10 mm2 of processing is needed. This is the reason why we investigated the excmer laser machining to GC mold fabrication. Micro hot embossing of Pyrex glass was demonstrated by using the mold.

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Imaging technology using the phase data attracts attention from many researchers as the observation technique of a biomechanical material. We produced a diffraction grating for obtaining high-resolution phase data. We designed the new process flow and developed the fabrication technique composed MEMS technology, X-ray lithography, and micro electro plating. The X-ray lithography process was performed using the NewSUBARU synchrotron radiation facility. The line and the aspect ratio of this grating were 4 µm and above 5, respectively. We evaluated the diffraction grating in SPring-8.

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This is the overview of the organized session “Production and valuation of surface function”. Although functional surfaces can bring beneficial design for high quality or mulch-functional products, a designer hasn′t enough knowledge and/or enough experience of design for functional surfaces. Especially for new products, frequent iteration from design department to QC department through manufacturing department leads to take much longer time to put them on the market. It is essential that designers for designing surface functions and manufacturing engineers for producing functional surfaces interact and discuss profoundly each other.

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This paper suggests the microgroove forming in order to improve the productivity in various work materials. Microgrooving mechanism using a rolling tool and a rubbing tool is discussed by measuring forming force and groove geometry as well as FEM analysis. Microgrooving can be achieved on rolling process in comparison of rubbing process, which generate steep burr.

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Design of hydrophilic/hydrophobic-patterned surfaces, stripe patterns of PTFE on SiO₂, were discussed to obtain intended sliding angle of drops. Firstly we discussed the drop shape on the stripe patterns as the factor affecting the sliding angle, and made clear that there is a range of the number of bridged patterns depending on the drop-size. Secondary, we proposed a drop shape model with polygonal profile for analyzing the sliding angle. Then it was presented that the larger the number of bridged pattern is, the larger the sliding angle becomes, and analytical result corresponded well with the experimental one.

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A carbon onion layer compounded with gold was formed by dispersing carbon onions on a silicon wafer coated with gold. Its solid lubricant properties were measured under a variety of conditions by ball-on-disk type friction test. The carbon onion layer compounded with gold has kept lower-friction coefficient of 0.03 for a longer time than gold layer in a certain range of gold film thickness and normal force. For achieving longer lifetime of the low-friction property, alloying silicon with gold and forming a self-assembled monolayer on gold thin film were attempted.

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