Proceedings of JSPE Semestrial Meeting
2005 JSPE Spring Meeting
Session ID : B08
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Characterization of Bonding States and Mechanical Properties of Boron Containing Thin Films Produced by Introducing CH4 Gas
*Masao Kohzaki
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Abstract
Thin films containing boron have been prepared on silicon substrates by DC magnetron sputtering using a sintered B4C target. The influences of CH4 addition as a plasma gas on the chemical bonding states, the critical loads in scratch tests and the friction coefficient of the films are investigated. Fourier-transform infrared spectroscopy measurements show that CH4 addition in the film formation process enhanced the formation of the B-C bond. Furthermore, frictional properties of the film against a steel ball are improved by CH4 addition in this study. Contrary to the frictional properties, the critical loads did not appreciably vary with the CH4 introduction.
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© 2005 The Japan Society for Precision Engineering
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