Abstract
AlN has advantages in thermal and dielectric characteristics and there are great demands for use as a base plate or packaging parts material. AlN is a sintered material and the AlN grains easily fall off during grinding process. Therefore it is difficult to obtain fine surface roughness. In previous works, we did machining experiments by ulara–precision plane honing. In this report, we investigated the falling off of AlN grains and the methods to control the grain boundary fracture by using diamond indentation tests. As a result, it became clear that rough ground surface is cracked under surface, witch causes falling off of AlN grains.
