Abstract
The relationship between the pad surface condition and polishing property, and the role of pad conditioning using two types of diamond pad conditioners in the CMP (chemical mechanical polishing) process were experimentally investigated, as basic research of diamond pad conditioning. The pad surface conditions result from clogging and from various conditioner specifications, and the conditioning parameters correlated with the Oxide-CMP process. The pad surface conditions decrease due to the planarization of micro asperities, and conditioning helps to reinstate the pad with asperities.
