Study on Electro-Chemical Mechanical Polishing of Cupper and Tantalum Thin Film: Polishing Characterisitics in the Case of Using Micro-Paticles

Abstract

A basic investigation of electro-chemical polishing for Cu/Lowk system multilevel metalization was carried out. In order to overcome the subjects relate to irregularity of electro-chemical reaction area in conventional technology, dielectric material particles, such as TiO2, were expected that the particles have the role of trigger of electro-chemical reaction on each particle surface. It is found that clear step was formed in border area of slurry existence and electro-chemical reaction may be very uniformly generated through the micro particles.