Abstract
SiC is a promising material for MEMS (micro electro mechanical system) used in harsh environments due to its superior mechanical, thermal and chemical properties. However, SiC is difficult to be micromachined compared to Si. Fundamental fabrication technologies such as CVD (chemical vapor deposition), RIE (reactive ion etching), polishing and bonding have been established for SiC, and surface micromachining and lost molding are ready for various SiC applications. The former is the combination of deposition, patterning and sacrificial etching, and used to fabricate SiC sensors and actuators including those integrated with circuits. The latter is pattern transfer from Si to SiC, and useful for SiC microparts and microtools.
