Abstract
Among various fabrication methods of MIDs, which are injection molded parts possessing wiring circuit on their surface, one that structures sputter deposited metal foil by laser irradiation provides the best quality in terms of fineness of wiring. On the other hand, its impossibility in structuring on hidden surface has been limiting its widespread application. To avoid this drawback, the authors have developed a technique in which the metal foil on a surface of the base part is successfully structured by laser irradiation from the reverse side of the part. In the previous study, copper foil on a side of acrylic flat plate was selectively removed by irradiation of near-UV laser from the other side. In this paper, copper foil on the inner surface of an acrylic cylinder is structured by laser irradiation from the outside into triple helixes of which pitch and spacing are 320μm and 220μm respectively. In order to improve peel strength of copper foil to acrylic surface, elecroless plating was employed instead of sputter deposition.
