Abstract
In semiconductor industry, a device that can measure the surface-profile of photoresist is needed. Since the photoresist surface is very smooth and deformable, the device is required to measure vertical direction with nanometer resolution and not to damage it at the measurement. In the last research, we proposed the method using multi-cantilever and white light interferometer to measure the surface-profile. This system with scanning method suffers from the presence of moving stage and systematic sensor errors. An approach used coupled distance sensors, together with an autocollimator as an additional angle measuring device, was proposed by Elster. In this report, we consult the potentiality for self- calibration of multi-cantilever of this method by simulation.
