Abstract
When an Al layer is adjacent to a Ni layer, an external electrical spark can initiate their interfacial reaction into NiAl alloy phase. This reaction is propagated by its own heat of reaction. Providing that the number of Al/Ni interface is increased by depositing multilayer films, large heat radiation can be obtained. Therefore, this multilayer films can be used for the local heating of solder for MEMS packaging. We have tried to deposit the Al/Ni multilayer films by means of dual source dc magnetron sputtering and investigated their self-propagating reaction behavior.
