Proceedings of JSPE Semestrial Meeting
2008 JSPE Spring Conference
Session ID : C18
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Host: The Japan Society for Precision Engineering

A study on film formation at Cu wafer surface in chemical solution
*Akira Imamura, Keiichi Kimura, Panart Khajornrungruang, Yuichi Hashiyama, Hirohumi Sumiyoshi, Hirokuni Hiyama, Yoshihiro Mochizuki
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Keywords: CMP, Cu wafer, Chemical solution, Film formation
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[in Japanese]
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© 2008 The Japan Society for Precision Engineering
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