Proceedings of JSPE Semestrial Meeting
2008 JSPE Spring Conference
Session ID : C20
Conference information

Host: The Japan Society for Precision Engineering

Development on slurry dispense mechanism by making use of capillary effect
*Takashi Fujita, Shuhei Oshida
Author information
Keywords: Chemical Mechanical Polishing, Slurry Dispense, Capillary Effect, Pad Groove, Slurry Consumption Reduction, Non-uniformity within wafer
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (323K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Abstract
[in Japanese]
Content from these authors
© 2008 The Japan Society for Precision Engineering
Previous article Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top