Development of Ni-P plated Inconel alloy mold for Pyrex glass imprinting

Abstract

Ni-P plated on a Si substrate was not able to be used for a thermal nanoimprint at the high temperature of 630 ºC or more because an adhesion force was weak. We thought that the cause was in the difference of a coefficient of thermal expansion between the Si substrate and Ni-P, and changed the substrate material to Inconel 600. The pattern of microlenses and the AIST logo was processed on the Ni-P electroless-plated Inconel alloy substrate by a focused-ion-beam lithography, and a mold was completed to imprint a Pyrex glass.