Proceedings of JSPE Semestrial Meeting
2009 JSPE Spring Conference
Session ID : M73
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Dicing Process with Ultrasonic Vibration
*Xiaoming QiuSouu KumagaiFumiteru TashinoNaritoshi Ozawa
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CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract
Responding to the requirements to handle difficult to dice materials such as glass,ceramics, metal and composite, the ultrasonic wave assisted dicing process has been developed. In this paper, the DISCO dicing saw with the ultrasonic wave air spindle was introduced. Based on the results of testing, spindle current can be significantly reduced, process efficiency increased and blade wear reduced when ultrasonic oscillation is used.
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© 2009 The Japan Society for Precision Engineering
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