Processing characteristics of the glass substrates by oxidation cerium and oxidation manganese slurries

Abstract

In this study, we paid attention to the oxidation manganese abrasives as the abrasive that replaces a large amount of cerium oxides (CeO2) used to polishing the glass substrate used for HDD, designed the slurry, and we understood the processing characteristics of the glass by experimental slurry. As a result, we achieved the polishing rate almost equal to the ceria slurry on the market, and we obtained the excellent result more than the equal in the surface-roughness of the glass substrate. We discovered the possibility as a new alternative abrasive grain material that replaced the cerium abrasive grain.