Proceedings of JSPE Semestrial Meeting
2011 JSPE Autumn Conference
Session ID : F80
Conference information

Host: The Japan Society for Precision Engineering

Highly planarization for a large-sized wafer using oscillation-speed-control-type polishing
- Elucidation of removal rate characteristics to improve simulation accuracy -
*Kenichiro Yoshitomi, Atsunobu Une, Masaaki Mochida
Author information
Keywords: CMP, silicon wafer, polisher, planarization, removal rate, polishing simulation
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (528K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Abstract
[in Japanese]
Content from these authors
© 2011 The Japan Society for Precision Engineering
Previous article Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top