2011 JSPE Autumn Conference
Session ID : K45
Conference information
Host: The Japan Society for Precision Engineering
Study on Thermal Stress Cleaving of Sapphire Wafer with Laser Beam
*Takahide Matsunaga, Takashi Ueda, Tatsuaki Furumoto, Akira Hosokawa, Ryutaro Tanaka, Syohei Nagatomo
Author information
Keywords:
Sapphire wafer,
Thermal stress cleaving
Details
