2011 JSPE Spring Conference
Session ID : D35
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Host: The Japan Society for Precision Engineering
CMP technique for copper surface finishing using water-soluble fullerenol (3rd report)
Investigation of the polishing performance of patterned wafers
*Hirotaka Kishida, Yasuhiro Takaya, Terutake Hayashi, Masaki Michihata, Ken Kokubo
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