Abstract
The Multi-wire Saw is used for the slicing of single crystal silicon ingot of the solar cells. In this processing method, a large number of wafers can be sliced at one time processing by using shin piano wire. On the other hand, the sliced wafer surface is ordered high quality and the high accuracy. But, many problems are occurring on the sliced surface. In this paper, the slurry behavior at the parallel and the chamfering part are observed by a high-speed video camera. And, the relations the slurry behavior at edge and the entered air behavior from wire exit are considered.
