Abstract
To obtain scientific guidelines for ductile-mode machining of silicon carbide (SiC), molecular dynamics (MD) simulations of nano-machining of SiC were carried out using three models. Firstly, in a simulation of nano-machining with a rigid diamond tool, amorphous phase transformation is inevitable for ductile-mode machining of SiC. Secondly, to investigate the tool wear and chipping phenomena, the rigid tool was replaced by dynamic one. In the simulation of nano-machining with the dynamic tool, no chip removal was observed due to a severe tool wear and a cutting edge chipping. Finally, to reduce stresses act on the tool, an amorphous layer was pre-formed on a surface to be cut in the third model. In the simulation, ductile-mode chip removal was observed as a result of the continuous and stable plastic flow by a shearing deformation in the amorphous region without the cutting edge chipping. Furthermore, the wear decreases by applying cutting fluid and slower cutting speed. However, the tool wear is still severe for cutting with single point cutting edge. In practice, to realize effective ductile-mode machining of SiC, it is recommended that mono-crystalline SiC should be pre-formed to amorphous SiC on the surface to be cut and grinded with lubricant.
