Proceedings of JSPE Semestrial Meeting
2012 JSPE Autumn Conference
Session ID : K69
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Host: The Japan Society for Precision Engineering

Development of FDM extrusion head for conductive resin
*Kenji Matsunaga, Hiroyuki Narahara, Hiroshi Suzuki, Hiroshi Koresawa
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Keywords: Fused Deposition Modeling, Molded Interconnect Device
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[in Japanese]
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© 2012 The Japan Society for Precision Engineering
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