Circuit Pattern Transfer to an Inner Surface of an MID through using Sacrificial Material

Damage of Copper Film After Elution of Sacrificial Material

Abstract

Parts with circuit patterns structured on injection molded thermoplastic parts are called MID(molded Interconnect Devices). The authors are applying sacrificial material method for fabricating complex structured MIDs. First, the authors produce an MID with a biodegradable plastic (PGA:Polyglycolic acid). The MID is then over molded with a plastic of high fluidity (LCP:Liquid Crystal Polymer), followed by an elution of PGA using NaOH. This paper reports on the damage of the Cu foil after the elution of PGA.