Relationship between CMP Pad Surface Texture and Conditioning Parameters Based on Kinematic Analysis

Abstract

Conditioning process is one of the most important processes to maintain the performance of CMP (Chemical Mechanical Polishing). In general, the conditioner electrodeposited diamond grain is used for the conditioning process. It is important to stabilize not only the surface micro-texture but also whole profiles of the polishing pad. This paper discusses the effect of the relative sliding distance on the cutting rate, and the relative sliding velocity on the pad surface micro-texture in the conditioning process. As a result, the following points were observed. (1) The cutting rate can be uniform using the parameters for achieving the uniform averaged relative sliding distance for all points of the whole pad. (2) The number of contact points, the contact ratio and the maximum value of minimum spacing of contact points depend on the averaged sliding velocity.