Constant-Force-Feeding Grinding System for Low Damage Density with High Grinding Rate Machining of Advanced Ceramics

Abstract

The proposed constant force-feeding grinding method modifies automatically the feeding rate depending on grinding conditions. Forces of a grinding wheel on a specimen are easily controlled by the present method. We have developed a system and proved an effect of constant-force-feeding grinding by this experiment. We used silicon wafers of 4-inch diameter and sintered-Al₂O₃ plates of 50×25×1mm to evaluate grinding forces, feeding rate and grinding defects. The present system takes only 50min to thin the silicon wafer to 40μm from 520μm thickness and the sintered-Al₂O₃ to 40μm from 1mm thickness by grinding.