Abstract
Sapphire has high hardness and chemical stability. Therefore, it is difficult to machine the sapphire. The sapphire is reacted by silicon dioxide under high pressure and high temperature. Sapphire was machined using this reaction in our method. Glass was chosen as the silicon dioxide-rich materials and cut with sapphire. Wear of the sapphire was regarded as the removal of the sapphire. The removal volume of the sapphire was increased with the machining time. The removal volume under the water atmosphere became more than that under the dry atmosphere. The smooth surface was obtained under the water atmosphere at the lower cutting speed and the smooth surface was obtained under the non-water atmosphere at the high cutting speed.
