Proceedings of JSPE Semestrial Meeting
2013 JSPE Autumn Conference
Session ID : J17
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Host: The Japan Society for Precision Engineering

Surface activated room-temperature bonding of electroplated Au patterns flattened by thermal imprint process
*Yuichi Kurashima, Atsuhiko Maeda, Jian Lo, Hideki Takagi
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Keywords: Surface activated room temperature bonding, Smoothing, Nanoimprint, Electroplating
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[in Japanese]
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© 2013 The Japan Society for Precision Engineering
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