Experimental verification of sub-nanometer order vibration analysis for semiconductor lithography equipments

Abstract

To improve the overlay accuracy in semiconductor lithography equipments, it is required to restrain the deformation of the structure body caused by vibration. For development of the structure body with countermeasures against vibration, vibration analysis has been utilized so effectively. This report describes the simulation results which correspond to the experimental evaluation of semiconductor lithography equipments in sub-nanometer order.