Proceedings of JSPE Semestrial Meeting
2013 JSPE Spring Conference
Session ID : I10
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Host: The Japan Society for Precision Engineering

Three-dimensional cutting edge distribution of diamond wheels
*Yutaro Ebina, Wei Hang, Libo Zhou, Jun Shimizu, Teppei Onuki, Hirotaka Ojima, Takeyuki Yamamoto, Takuya Watanabe
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Keywords: sapphire wafer, grinding process, removal mechanism, diamond wheels
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[in Japanese]
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© 2013 The Japan Society for Precision Engineering
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